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Thermal Imaging — Seeing What the Eye Can't

An infrared (IR) camera detects temperature differences on panel surfaces. A healthy panel operating under uniform irradiance should be uniformly warm. Any abnormally hot region indicates a point of electrical power dissipation — either a hotspot (shading, cell fault) or a high-resistance connection (poor crimp, corroded contact). Thermal imaging is the fastest and least invasive way to survey a large array for faults.

Common Thermal Fault Signatures

Thermal Pattern

Fault Type

Severity

Single cell hot (1–2°C above rest of panel)

Cell micro-crack or internal defect

Low — monitor; plan replacement at next opportunity

Single cell very hot (>20°C above rest)

Hotspot — potential bypass diode failure or heavy shading point

High — investigate immediately; fire risk if sustained

One bypass diode group hot (one-third of panel)

Cell group shaded or bypass diode failed short-circuit

Moderate — locate and remove shading source or replace panel

Entire panel hot relative to neighbours

String current mismatch — panel degraded or cracked

Moderate — check with I-V curve tester

Hot junction box on panel

Internal connection fault in junction box

High — junction box may need replacement

Hot connector point (in-string)

High-resistance MC4 connector — partial mating or oxidised contact

High — arc fault risk; replace connector immediately

Thermal Imaging Best Practices

  • Survey during periods of high irradiance (>700 W/m²) with panels near maximum operating current — low irradiance reveals fewer faults

  • Survey from the roof (not the ground) for best resolution on individual cell-level faults

  • Record GPS coordinates or panel grid position for each fault found

  • Compare consecutive annual thermal surveys — trending hotspot severity identifies panels approaching failure before they fail

Engr. Jason Morales — Founder, SolarEnergyPH

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